Electrifi™ EMI Shielding Enclosure

Conductive 3D Printed Alternative to Metallized Plastic Housings

$311.30

Overview

The Electrifi™ EMI Shielding Enclosure is a fully conductive 3D printed housing designed as a functional alternative to metallized plastic enclosures such as the 1594RFI-style RFI-shielded cases.

Fabricated using Electrifi™ high-conductivity copper composite filament, this enclosure provides inherent electrical conductivity throughout the structure — eliminating the need for post-processing steps such as conductive coatings, vapor deposition, or foil lining.

This prototype demonstrates the potential of conductive additive manufacturing for integrated electromagnetic shielding solutions.

This product is offered as an engineering sample under the Electrifi™ Functional Prototype Validation Program.

Key Features

  • Fully conductive bulk material (no coating required)

  • Designed for EMI/RFI mitigation

  • Compatible with standard PCB mounting workflows

  • Lightweight, additively manufactured structure

  • Rapid customization capability

  • Suitable for validation and shielding effectiveness testing

Physical & Fabrication Specifications

Parameter

Specification

Dimensions

80 mm × 55 mm × 40 mm

Weight

110 g

Material

Electrifi™ conductive filament

Manufacturing Process

FFF (Fused Filament Fabrication)

Nozzle Diameter

0.6 mm

Layer Height

0.3 mm

Infill

100%

The structure is printed fully solid to maximize electrical continuity and mechanical integrity.

Applications

  • Embedded electronics housing

  • Sensor enclosures

  • RF module shielding

  • Prototype PCB containment

  • Rapid EMI mitigation testing

  • Research into conductive polymer shielding

Engineering Sample Notice

Participants are encouraged to evaluate:

  • Shielding effectiveness (SE) in dB

  • Surface resistance measurements

  • Ground continuity

  • Frequency-dependent attenuation

  • Leakage points at seams and joints

Submitted validation data may qualify for store credit under the Electrifi™ Functional Prototype Validation Program.

Why Electrifi™ for RF Components?

Traditional EMI enclosures typically rely on:

  • Metallized plastic housings

  • Conductive spray coatings

  • Adhesive copper tape

  • Internal foil liners

These approaches introduce:

  • Additional processing steps

  • Surface-only conductivity

  • Coating adhesion concerns

  • Increased manufacturing complexity

Electrifi™ enables:

  • Bulk conductivity throughout the enclosure

  • Simplified fabrication

  • Rapid design iteration

  • Integrated grounding features

  • Direct printing of complex geometries

Electrifi™ functional prototypes are sealed with desiccant in moisture-barrier packaging and labeled with full material specifications.

Electrifi™ functional prototypes typically have a lead time of 5–6 business days. Once printing is complete, the parts are promptly processed and shipped via reliable carriers.

  • Domestic (U.S.) Orders: Typically delivered within 2–3 business days after shipment.

  • International Orders: Typically delivered within 3–6 business days, depending on destination and customs processing.

Tracking information is provided once your order has shipped.

We accept returns of unopened packages, no questions asked. Customers are responsible for return shipping costs unless the product is defective.